2003 Feb 24

10

Philips Semiconductors

Product specification

CDMA800 power module

BGF802-20

PACKAGE OUTLINE

UNIT

Q

b

Z

c

e

U2

U1

U

Fp

q

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

01-06-06

02-11-13

IEC

JEDEC

JEITA

mm

4.0

3.8

0.56

0.46

A

9.5

9.0

0.3

0.2

D

30.1

29.9

E

18.6

18.4

12.8

12.6

3.55

3.45

41.75

41.65

2.54

e1

20.32

3.3

3.1

L

3.7

3.3

7.75

7.55

U3

1.1

0.0

15.4

15.2

48.4

48.0

0.3

0.25

vw

0.1

y

DIMENSIONS (mm are the original dimensions)

SOT365C

0

10

20 mm

scale

Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 3 in-line leads

SOT365C

p

U2

U3

F

A

U1

U

D

q

E

L

y

Q

c

v A

A

b

Z

23

1

e1

e