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BGF802-20 Datasheet(PDF) 10 Page - NXP Semiconductors |
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BGF802-20 Datasheet(HTML) 10 Page - NXP Semiconductors |
10 / 12 page 2003 Feb 24 10 Philips Semiconductors Product specification CDMA800 power module BGF802-20 PACKAGE OUTLINE UNIT Q b Z c e U2 U1 U Fp q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 01-06-06 02-11-13 IEC JEDEC JEITA mm 4.0 3.8 0.56 0.46 A 9.5 9.0 0.3 0.2 D 30.1 29.9 E 18.6 18.4 12.8 12.6 3.55 3.45 41.75 41.65 2.54 e1 20.32 3.3 3.1 L 3.7 3.3 7.75 7.55 U3 1.1 0.0 15.4 15.2 48.4 48.0 0.3 0.25 vw 0.1 y DIMENSIONS (mm are the original dimensions) SOT365C 0 10 20 mm scale Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 3 in-line leads SOT365C p U2 U3 F A U1 U D q E L y Q c v A A w M b Z 23 1 e1 e |
Similar Part No. - BGF802-20 |
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Similar Description - BGF802-20 |
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