ATZB-RF-233-1-C ZigBit 2.4GHz Wireless Modules [DATASHEET]

42192C

−WIRELESS−08/2015

14

Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior

performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers

of the carrier board

The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be

equal to or greater than 25mm

3.6

Soldering Profile

The J-STD-020C-compliant soldering profile is recommended according to Table 3-8.

Table 3-8.

Soldering profile

(1)

Profile feature

Green package

Average ramp-up rate (217°C to peak)

3°C/s max

Preheat temperature 175°C ±25°C

180s max

Temperature maintained above 217°C

60s to 150s

Time within 5°C of actual peak temperature

20s to 40s

Peak temperature range

260°C

Ramp-down rate

6°C/s max

Time within 25°C to peak temperature

8 minutes

Note:

1.

The package is backward compatible with PB/Sn soldering profile.

3.7

Antenna Reference Designs

Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board

material and thickness, shields, the material used for enclosure, the board neighborhood, and other components

adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.

General Recommendations:

•

Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.

•

Placing high profile components next to antenna should be avoided.

•

Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board

edges also distorting antenna pattern.

•

ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band

frequency.

The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of

high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna

pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.

4.

Schematics

The following schematic drawings for the ATZB-RF-233-1-C are in the following order:

•

Top level schematics

•

AT86RF233 schematics