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G941T26U Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc |
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G941T26U Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc |
2 / 8 page Ver: 5.5 May 13, 2002 TEL: 886-3-5788833 http://www.gmt.com.tw 2 G940/G941 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage……………………………..……..…..…10V Power Dissipation Internally Limited ..(Note 2) Maximum Junction Temperature………….….…...150°C Storage Temperature Range…..…..…..-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering SOT 89, SOT23 Package….….…..……..…....260°C, 4s Continuous Power Dissipation (TA = + 25°C) SOT 23 (1)…….…………………….….……….……...0.3W SOT 89 (1)……………………….………..………..…0.42W Note (1): See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage………………………….…………….4V~7V Temperature Range………………….…0°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 400mA, CIN = 1 µF, COUT =10 µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX UNITS Output Voltage Accuracy IO = 10mA -2 - +3 % Line Regulation VIN = 4V to 7V, IO = 50mA - 0.08 0.9 %/V Load Regulation IO = 10mA to 400mA - - 2.2 % Output Impedance 100mA DC and 100mA AC, fo = 120Hz - 100 - m Ω Quiescent Current VIN=5V - 0.6 - mA Ripple Rejection fi = 120 Hz, 1VP-P, Io = 100mA - 42 - dB IO = 400mA - 0.8 0.9 V Dropout Voltage IO = 100mA - 130 150 mV Short Circuit Current - 0.76 - A Over Temperature - 125 - °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Condi- tions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re- sistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem- perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 130°C and IC will go into thermal shutdown. For the G940/G941 in SOT 23 package, θJA is 350°C/W and in the SOT 89 package is 250°C/W (See Recommend Minimum Footprint). The safe operation in SOT 23 & SOT 89 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af- fected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measure- ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem- perature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. |
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