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LTC4354CS8 Datasheet(PDF) 11 Page - Linear Technology |
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LTC4354CS8 Datasheet(HTML) 11 Page - Linear Technology |
11 / 12 page LTC4354 11 4354f PACKAGE DESCRIPTIO DDB Package 8-Lead Plastic DFN (3mm × 2mm) (Reference LTC DWG # 05-08-1702) 2.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.38 ± 0.10 BOTTOM VIEW—EXPOSED PAD 0.56 ± 0.05 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP 2.15 ±0.05 (2 SIDES) 3.00 ±0.10 (2 SIDES) 1 4 8 5 PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF 0 – 0.05 (DDB8) DFN 1103 0.25 ± 0.05 2.20 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.61 ±0.05 (2 SIDES) 1.15 ±0.05 0.675 ±0.05 2.50 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC PIN 1 CHAMFER OF EXPOSED PAD 0.50 BSC S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) .016 – .050 (0.406 – 1.270) .010 – .020 (0.254 – 0.508) × 45° 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0303 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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