NCV4275

http://onsemi.com

2

PIN FUNCTION DESCRIPTION

Pin No.

Symbol

Description

1

I

Input; Battery Supply Input Voltage. Bypass to ground with a ceramic capacitor.

2

RO

Reset Output; Open Collector Active Reset (accurate when I > 1.0 V).

3

GND

Ground; Pin 3 internally connected to tab.

4

D

Reset Delay; timing capacitor to GND for Reset Delay function.

5

Q

Output;

±2.0%, 450 mA output. Use 22 mF, ESR < 5.0 Ω to ground.

MAXIMUM RATINGS†

Rating

Min

Max

Unit

Input [I (DC)]

−42

45

V

Input [I (Peak Transient Voltage)]

−

45

V

Output (Q)

−1.0

16

V

Reset Output (RO)

−0.3

25

V

Reset Output (RO)

−5.0

5.0

mA

Reset Delay (D)

−0.3

7.0

V

Reset Delay (D)

−2.0

2.0

mA

Operating Range (I)

5.5

42

V

ESD Susceptibility (Human Body Model)

2.0

−

kV

Junction Temperature

−40

150

°C

Storage Temperature

−55

150

°C

Lead Temperature Soldering

Reflow (SMD styles only) Note 1

Wave Solder (through hole styles only) Note 2

−

−

240 Peak

(Note 3)

260 Peak

°C

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values

(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage

may occur and reliability may be affected.

THERMAL CHARACTERISTICS

Parameter

Test Conditions (Typical Value)

Unit

DPAK 5−PIN PACKAGE

Min Pad Board (Note 4)

1

″ Pad Board (Note 5)

Junction−to−Tab (psi−JLx,

4.2

4.7

C/W

100.9

46.8

C/W

0.4 sq. in. Spreader Board (Note 6)

1.2 sq. in. Spreader Board (Note 7)

Junction−to−Tab (psi−JLx,

3.8

4.0

C/W

74.8

41.6

C/W

1. 60 seconds max above 183

°C.

2. 10 seconds max.

3. −5

°C/+0°C allowable conditions.

″ thick FR4.

″ thick FR4.

″ thick FR4.

″ thick FR4.

†During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal

dissipation must be observed closely.