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PSMN006-20K Datasheet(PDF) 5 Page - NXP Semiconductors |
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PSMN006-20K Datasheet(HTML) 5 Page - NXP Semiconductors |
5 / 12 page Philips Semiconductors PSMN006-20K TrenchMOS™ ultra low level FET Product data Rev. 01 — 30 May 2002 5 of 12 9397 750 09631 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 8. Characteristics Table 5: Characteristics Tj =25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 µA; VGS = 0 V 20 --V VGS(th) gate-source threshold voltage ID = 1 mA; VDS =VGS; Figure 9 Tj =25 °C 0.4 0.7 - V Tj = 150 °C 0.15 - - V IDSS drain-source leakage current VDS =20V; VGS =0V Tj =25 °C - 0.05 1 µA Tj = 150 °C - - 0.5 mA IGSS gate-source leakage current VGS = ±8 V; VDS = 0 V - 10 100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID =5A; Figure 7 and 8 - 4.2 5 m Ω VGS = 2.5 V; ID =5A; Figure 7 and 8 - 4.8 5.7 m Ω VGS = 1.8 V; ID =5A; Figure 8 - 5.7 8.2 m Ω Dynamic characteristics gfs forward transconductance VDS =15V; ID =10A - 25 - S Qg(tot) total gate charge ID = 30 A; VDD =10V; VGS = 2.5 V; Figure 13 -32 - nC Qgs gate-source charge - 10 - nC Qgd gate-drain (Miller) charge - 13.2 - nC Ciss input capacitance VGS =0V; VDS = 20 V; f = 1 MHz; Figure 11 -4350 -pF Coss output capacitance - 825 - pF Crss reverse transfer capacitance - 550 - pF td(on) turn-on delay time VDD =10V; RL =10 Ω; VGS = 4.5 V; RG =6 Ω -65 - ns tr rise time -32 - ns td(off) turn-off delay time - 190 - ns tf fall time -90 - ns Source-drain diode VSD source-drain (diode forward) voltage IS = 3 A; VGS =0V; Figure 12 - 0.75 1.3 V trr reverse recovery time IS = 10 A; dIS/dt = −70 A/µs; VGS = 0 V - 47 - ns Qr recovery charge - 17 - nC |
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