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CY62158CV25/30/33
MoBL™
Document #: 38-05019 Rev. *C
Page 4 of 12
Electrical Characteristics Over the Operating Range (continued)
CY62158CV33-55
CY62158CV33-70
Parameter
Description
Test Conditions
Min.
Typ.[4]
Max.
Min.
Typ.[4]
Max.
Unit
VOH
Output HIGH Voltage
IOH = –1.0 mA
VCC = 3.0V
2.4
2.4
V
VOL
Output LOW Voltage
IOL = 2.1 mA
VCC = 3.0V
0.4
0.4
V
VIH
Input HIGH Voltage
2.2
VCC+
0.3V
2.2
VCC+
0.3V
V
VIL
Input LOW Voltage
–0.3
0.8
–0.3
0.8
V
IIX
Input Leakage Current GND < VI < VCC
–1
+1
–1
+1
µA
IOZ
Output Leakage
Current
GND < VO < VCC, Output Disabled
–1
+1
–1
+1
µA
ICC
VCC Operating Supply
Current
f = fMAX = 1/tRC
VCC = 3.6V
IOUT = 0 mA
CMOS Levels
7
15
5.5
12
mA
f = 1 MHz
1.5
2
1.5
2
ISB1
Automatic CE
Power-Down Current
— CMOS Inputs
CE1 > VCC – 0.2V or CE2 < 0.2V
VIN > VCC – 0.2V or VIN < 0.2V,
f = fmax (Address and Data Only),
f=0 (OE, WE)
10
30
10
30
µA
ISB2
Automatic CE
Power-Down Current
— CMOS Inputs
CE1 > VCC − 0.2V or CE2 < 0.2V
VIN > VCC − 0.2V or VIN < 0.2V,
f = 0, VCC = 3.6V
Capacitance[5]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC = VCC(typ.)
6
pF
COUT
Output Capacitance
8
pF
Thermal Resistance
Description
Test Conditions
Symbol
BGA
Unit
Thermal Resistance[5]
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch, two-layer printed
circuit board
Θ
JA
55
°C/W
Thermal Resistance[5]
(Junction to Case)
Θ
JC
16
°C/W
Note:
5.
Tested initially and after any design or process changes that may affect these parameters.