11

The maximum power dissipation actually produced by the IC

is the total quiescent supply current times the total power

supply voltage and plus the power in the IC due to the loads.

when sourcing, and:

when sinking.

Where:

• i = 1 to total 12

package power dissipation curves provide a convenient way

to see if the device will overheat.

POWER SUPPLY BYPASSING AND PRINTED CIRCUIT

BOARD LAYOUT

Good printed circuit board layout is necessary for optimum

performance. A low impedance and clean analog ground

plane should be used for the EL5226 and EL5326. The

traces from the two ground pins to the ground plane must be

very short. The thermal pad of the EL5226 and EL5326

should be connected to the analog ground plane. Lead

length should be as short as possible and all power supply

pins must be well bypassed. A 0.1µF ceramic capacitor must

pins. A 4.7µF local bypass tantalum capacitor should be

APPLICATION USING THE EL5226 AND EL5326

In the first application drawing, the schematic shows the

interconnect of a pair of EL5226 and EL5326 chips

connected to give 8 gamma corrected voltages above the

(

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+

×

=

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+

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=

EL5226, EL5326