DDR SDRAM

256MB, 512MB, 1GB Unbuffered DIMM

Rev. 1.0 February. 2005

Absolute Maximum Ratings

Parameter

Symbol

Value

Unit

-0.5 ~ 3.6

V

-1.0 ~ 3.6

V

Storage temperature

-55 ~ +150

°C

Power dissipation

1.5 * # of component

W

Short circuit current

50

mA

Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.

Functional operation should be restricted to recommend operation condition.

Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

DC Operating Conditions

°C)

Parameter

Symbol

Min

Max

Unit

Note

2.3

2.7

V

2.5

2.7

V

2.3

2.7

V

2.5

2.7

V

I/O Reference voltage

0.49*VDDQ

0.51*VDDQ

V

1

I/O Termination voltage(system)

V2

Input logic high voltage

V

Input logic low voltage

-0.3

V

Input Voltage Level, CK and CK inputs

-0.3

V

Input Differential Voltage, CK and CK inputs

0.36

V

3

V-I Matching: Pullup to Pulldown Current Ratio

VI(Ratio)

0.71

1.4

-

4

Input leakage current

-2

2

uA

Output leakage current

-5

5

uA

-16.8

mA

16.8

mA

-9

mA

9mA

1. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of same. Peak-to

peak noise on VREF may not exceed +/-2% of the dc value.

4. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temper-

ature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it represents the maximum

difference between pullup and pulldown drivers due to process variation. The full variation in the ratio of the maximum to mini-

mum pullup and pulldown current will not exceed 1.7 for device drain to source voltages from 0.1 to 1.0.

Note :