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MAX9040BEUK-T Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX9040BEUK-T Datasheet(HTML) 10 Page - Maxim Integrated Products |
10 / 15 page 3) In this example, let VCC = 5V and VREF = 2.5V: and 4) Select R2. In this example, we will choose 1k Ω. 5) Select VHYS. In this example, we will choose 50mV. 6) Solve for R1: where R1 ≈ 100kΩ, VTH = 2.525V, and VTL = 2.475V. Board Layout and Bypassing Power-supply bypass capacitors are not typically need- ed, but would be called for in cases where supply impedance is high, supply leads are long, or excessive noise is expected on the supply lines. Use 100nF bypass capacitors under these conditions. Minimize signal trace lengths to reduce stray capacitance. Reference Output/Load Capacitance The MAX9039/MAX904_/MAX905_ do not require an output capacitor on REF for frequency stability. They are stable for capacitive loads up to 4.7nF. However, in applications where the load or the supply can experi- ence step changes, an output capacitor will reduce the amount of overshoot (or undershoot) and assist the cir- cuit’s transient response. When an application is not subject to transient conditions, the REF capacitor can be omitted. Biasing for Data Recovery Digital data is often embedded into a bandwidth- and amplitude-limited analog path. Recovering the data can be difficult. Figure 2 compares the input signal to a time-averaged version of itself. This self-biases the threshold to the average input voltage for optimal noise margin. Even severe phase distortion is eliminated from the dig- ital output signal. Be sure to choose R1 and C1 so that: where fCAR is the fundamental carrier frequency of the digital data stream. UCSP Package Consideration For general UCSP package information and PC layout considerations, please refer to Maxim Application Note,"Wafer-Level Chip-Scale Package." UCSP Reliability The chip-scale package (UCSP) represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical relia- bility tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP. Performance through Operating Life Test and Moisture Resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater considera- tion for a UCSP. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Information on Maxim’s qualification plan, test data, and recommendations are detailed in the UCSP appli- cation note, which can be found on Maxim’s website at www.maxim-ic.com. Chip Information MAX9039 TRANSISTOR COUNT: 193 MAX9040/MAX9041/MAX9050/MAX9051 TRANSISTOR COUNT: 204 MAX9042/MAX9043/MAX9052/MAX9053 TRANSISTOR COUNT: 280 f 1 2R1C1 CAR >> π 0 050 5 1000 1 1000 . = + R VV R RR HYS CC = + 2 12 V R RR TL =− + 25 1 2 12 . V R RR TH =+ + 25 25 2 12 .. Micropower, Single-Supply, UCSP/SOT23 Comparator + Precision Reference ICs 10 ______________________________________________________________________________________ MAX9039–MAX9043 MAX9050–MAX9053 OUT IN+ IN- 10k Ω 0.1 µF VCC VIN VEE VCC Figure 2. Time Averaging of the Input Signal for Data Recovery |
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