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TMS320VC5503PGE Datasheet(PDF) 3 Page - Texas Instruments |
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TMS320VC5503PGE Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 123 page  Revision History 3 April 2004 − Revised January 2005 SPRS245C REVISION HISTORY This data sheet revision history highlights the technical changes made to the SPRS245B device-specific data sheet to make it an SPRS245C revision. Scope: Added Section 4.1, Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability; added Package Addendum, etc. PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS Global: − moved “Package Thermal Resistance Characteristics” section to Section 6, Mechanical Data − added Package Addendum 17 Table 2−3, Signal Descriptions: − HPI.HRDY: changed value of “I/O/Z” column from “O/Z” to “O” 35 Section 3.5.1, External Bus Selection Register (EBSR): − appended “After reset, the parallel port should be selected to function in either EMIF mode or HPI mode. Dynamic switching of the parallel port, once configured, is not recommended.” to “The reset value of the parallel port mode bit field is determined by ...” paragraph 57 Table 3−27, I2C Module Registers: − 0x3C0B: changed “I2C General-Purpose Register” (I2CGPIO) to “Reserved” 63 Section 4: − renamed section from “Documentation Support” to “Support” 63 Section 4, Support: − added Section 4.1, Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability − added Section 4.1.1, Initialization Requirements for Boundary Scan Test − added Section 4.1.2, Boundary Scan Description Language (BSDL) Model 63 Added section title “4.2 Documentation Support” 64 Updated Section 4.3, Device and Development-Support Tool Nomenclature 111 Figure 5−32, EHPI Nonmultiplexed Read/Write Timings: − updated “The falling edge of HCS must occur concurrent with or before the falling edge of HDS ...” footnote 112 Figure 5−33, EHPI Multiplexed Memory (HPID) Read/Write Timings Without Autoincrement: − updated “The falling edge of HCS must occur concurrent with or before the falling edge of HDS ...” footnote 113 Figure 5−34, EHPI Multiplexed Memory (HPID) Read Timings With Autoincrement: − updated “The falling edge of HCS must occur concurrent with or before the falling edge of HDS ...” footnote 114 Figure 5−35, EHPI Multiplexed Memory (HPID) Write Timings With Autoincrement: − updated “The falling edge of HCS must occur concurrent with or before the falling edge of HDS ...” footnote 115 Figure 5−36, EHPI Multiplexed Register Read/Write Timings: − updated “The falling edge of HCS must occur concurrent with or before the falling edge of HDS ...” footnote 119 Section 6, Mechanical Data: − added new Section 6.1, Package Thermal Resistance Characteristics − added new Section 6.2, Packaging Information |
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