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ZL50115 Datasheet(PDF) 11 Page - Zarlink Semiconductor Inc |
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ZL50115 Datasheet(HTML) 11 Page - Zarlink Semiconductor Inc |
11 / 95 page ZL50115/16/17/18/19/20 Data Sheet 11 Zarlink Semiconductor Inc. 3.0 Physical Specification The ZL5011x will be packaged in a PBGA device. Features: • Body Size: 23 mm x 23 mm (typ) • Ball Count: 324 • Ball Pitch: 1.00 mm (typ) • Ball Matrix: 22 x 22 • Ball Diameter: 0.60 mm (typ) • Total Package Thickness: 2.03 mm (typ) |
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