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TE28F016B3TA90 Datasheet(PDF) 8 Page - Intel Corporation |
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TE28F016B3TA90 Datasheet(HTML) 8 Page - Intel Corporation |
8 / 48 page SMART 3 ADVANCED BOOT BLOCK E 8 PRELIMINARY A 14 A 15 A 16 A 17 V CCQ A 12 A 10 A 13 NC A 11 A 8 WE# A 9 D 5 D 6 V PP RP# NC NC WP# A 19 A 21 D 2 D 3 A 20 A 18 A 6 NC NC A 7 A 5 A 3 CE# D 0 A 4 A 2 A 1 A 0 GND GND D 7 NC D 4 V CC NC D 1 OE# A B C D E F 13 25 47 68 16M 32M 8M 0580_04 NOTE: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the upgrade address for the 32-Mbit device. 2. 4-Mbit density not available in µBGA* CSP. Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down) |
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Similar Description - TE28F016B3TA90 |
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