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GT28F160B3TA110 Datasheet(PDF) 9 Page - Intel Corporation |
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GT28F160B3TA110 Datasheet(HTML) 9 Page - Intel Corporation |
9 / 48 page E SMART 3 ADVANCED BOOT BLOCK 9 PRELIMINARY A 13 A 14 A 15 A 16 V CCQ A 11 A 10 A 12 D 14 D 15 A 8 WE# A 9 D 5 D 6 V PP RP# D 11 D 12 WP# A 18 A 20 D 2 D 3 A 19 A 17 A 6 D 8 D 9 A 7 A 5 A 3 CE# D 0 A 4 A 2 A 1 A 0 GND GND D 7 D 13 D 4 V CC D 10 D 1 OE# A B C D E F 13 25 47 68 16M 32M 8M 0580_03 NOTES: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the upgrade address for the 32-Mbit device. 2. 4-Mbit density not available in µBGA* CSP. Figure 4. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down) |
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