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HPL1117-28V Datasheet(PDF) 11 Page - List of Unclassifed Manufacturers |
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HPL1117-28V Datasheet(HTML) 11 Page - List of Unclassifed Manufacturers |
11 / 19 page Rev. B.13 - Mar., 2004 HPL1117 11 Copyright HIPAC Semiconductor, Inc. www.hipacsemi.com Output Capacitor (Cont.) Application Information (Cont.) Aluminum electrolytics can also be used, as long as the ESR of the capacitor is <1 Ω. The value of the output capacitor can be increased without limit. Higher capacitance values help to improve transient response and ripple rejection and reduce output noise. The curves for Ripple Rejection were generated us- ing an adjustable device with the adjust pin bypassed. With a 22 µF bypassing capacitor 75dB ripple rejec- tion is obtainable at any output level. The impedance of the adjust pin capacitor, at the ripple frequency, should be < R1. R1 is normally in the range of 100 Ω- 200 Ω. The size of the required adjust pin capacitor is a function of the input ripple frequency. At 120Hz, with R1=100 Ω, the adjust pin capacitor should be 13 µF. For fixed voltage devices, and adjustable de- vices without an adjust pin capacitor, the output ripple will increase as the ratio of the output voltage to the reference voltage (VOUT /VREF ). Ripple Rejection Thermal Considerations HPL1117 has thermal protection which limits junction temperature to 150°C. However, device functionality is only guaranteed to a maximum junction tempera- ture of +125°C. Both the TO-220, TO-252, TO-263 and SOT-223 packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 3&4 shows for the TO-252 and SOT-223 the measured values of θ(J-A) for different copper area sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4 PCB with 2oz. copper and a ground plane layer on the backside area used for heatsinking. It can be used as a rough guideline in estimating thermal resistance. 25 30 35 40 45 50 0 246 8 10 12 14 TA=25°C Top Copper Area (cm2) Figure 3. θ(J-A) vs. copper area for the TO-252 package |
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