HPL1117-28V datasheet(11/19 Pages) ETC

Part #	HPL1117-28V

Description	1A Low Dropout Fast Response Positive Adjustable Regulator and Fixed 1.8V, 2.5V, 2.85V, 3.3V and 5V

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11 / 19 page

Rev. B.13 - Mar., 2004

HPL1117

11

 Copyright HIPAC Semiconductor, Inc.

www.hipacsemi.com

Output Capacitor (Cont.)

Application Information (Cont.)

Aluminum electrolytics can also be used, as long as

the ESR of the capacitor is <1

Ω. The value of the

output capacitor can be increased without limit. Higher

capacitance values help to improve transient response

and ripple rejection and reduce output noise.

The curves for Ripple Rejection were generated us-

ing an adjustable device with the adjust pin bypassed.

With a 22

µF bypassing capacitor 75dB ripple rejec-

tion is obtainable at any output level. The impedance

of the adjust pin capacitor, at the ripple frequency,

should be < R1. R1 is normally in the range of 100

Ω-

200

Ω. The size of the required adjust pin capacitor

is a function of the input ripple frequency. At 120Hz,

with R1=100

Ω, the adjust pin capacitor should be

13

µF. For fixed voltage devices, and adjustable de-

vices without an adjust pin capacitor, the output ripple

will increase as the ratio of the output voltage to the

reference voltage (VOUT /VREF ).

Ripple Rejection

Thermal Considerations

HPL1117 has thermal protection which limits junction

temperature to 150°C. However, device functionality

is only guaranteed to a maximum junction tempera-

ture of +125°C.

Both the TO-220, TO-252, TO-263 and SOT-223

packages use a copper plane on the PCB and the

PCB itself as a heatsink. To optimize the heat sinking

ability of the plane and PCB, solder the tab of the

package to the plane.

Figure 3&4 shows for the TO-252 and SOT-223 the

measured values of

θ(J-A) for different copper area

sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4

PCB with 2oz. copper and a ground plane layer on

the backside area used for heatsinking. It can be

used as a rough guideline in estimating thermal

resistance.

25

30

35

40

45

50

0

246

8

10

12

14

TA=25°C

Top Copper Area (cm2)

Figure 3.

θ(J-A) vs. copper area for the TO-252 package

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