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K4S51153PF-YF Datasheet(PDF) 5 Page - Samsung semiconductor

Part # K4S51153PF-YF
Description  8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4S51153PF-YF Datasheet(HTML) 5 Page - Samsung semiconductor

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K4S51153PF - Y(P)F
September 2004
5
Mobile SDRAM
DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25 to 70
°C for Commercial)
NOTES:
1. Measured with outputs open.
2. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ).
Parameter
Symbol
Test Condition
Version
Unit
Note
-75
-90
-1L
Operating Current
(One Bank Active)
ICC1
Burst length = 1
tRC
≥ tRC(min)
IO = 0 mA
60
55
50
mA
1
Precharge Standby Current in
power-down mode
ICC2P
CKE
≤ VIL(max), tCC = 10ns
0.6
mA
ICC2PS
CKE & CLK
≤ VIL(max), tCC = ∞
0.6
Precharge Standby Current
in non power-down mode
ICC2N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
20
mA
ICC2NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
2
Active Standby Current
in power-down mode
ICC3P
CKE
≤ VIL(max), tCC = 10ns
10
mA
ICC3PS
CKE & CLK
≤ VIL(max), tCC = ∞
2
Active Standby Current
in non power-down mode
(One Bank Active)
ICC3N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 10ns
Input signals are changed one time during 20ns
40
mA
ICC3NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
10
mA
Operating Current
(Burst Mode)
ICC4
IO = 0 mA
Page burst
4Banks Activated
tCCD = 2CLKs
95
80
80
mA
1
Refresh Current
ICC5
tARFC
≥ tARFC(min)
95
95
95
mA
Self Refresh Current
ICC6
CKE
≤ 0.2V
TCSR Range
Max 40
Max 70
°C
Full Array
400
900
uA
1/2 of Full Array
320
600
1/4 of Full Array
280
500


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