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S29WS064N0LBFI011 Datasheet(PDF) 11 Page - SPANSION |
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S29WS064N0LBFI011 Datasheet(HTML) 11 Page - SPANSION |
11 / 99 page January 25, 2005 S29WS-N_00_G0 S29WS-N MirrorBit™ Flash Family 9 Ad vance Information 4 Physical Dimensions/Connection Diagrams This section shows the I/O designations and package specifications for the S29WS-N. 4.1 Related Documents The following documents contain information relating to the S29WS-N devices. Click on the title or go to www.amd.com/flash (click on Technical Documentation) or www.fujitsu.com to download the PDF file, or request a copy from your sales office. Migration to the S29WS256N Family Application Note Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits 4.2 Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth- ods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. |
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