MT90881G datasheet(11/97 Pages) ZARLINK

Part #	MT90881G

Description	TDM to Packet Processors

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Manufacturer	ZARLINK [Zarlink Semiconductor Inc]

Direct Link	http://www.zarlink.com

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MT90880/1/2/3

Data Sheet

11

Zarlink Semiconductor Inc.

2.0

Physical Specification

The device is contained in a 456-ball plastic ball grid array (456 PBGA) package:

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Body Size: 27 mm x 27 mm

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Ball Count: 456

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Ball Pitch: 1.0 mm

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Ball Matrix: 26 x 26 (partially populated with a 6 x 6 GND matrix in the centre)

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Ball Diameter 0.63 mm

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Total Package Thickness 2.03 mm

Package is viewed from the top side (e.g,. through top of the package). Note ball A1 is non-chamfered corner.

Figure 2 - Package View and Ball Positions

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