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SP959B01-TD01 Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers

Part # SP959B01-TD01
Description  China Electronics Technology Group Corporation No.26 Research Institute
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SP959B01-TD01 Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers

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SIPAT Co.,Ltd
www.sipatsaw.com
China Electronics Technology Group Corporation No.26 Research Institute
P.O. Box 2513 Chongqing, China 400060 Tel:+86-23-62920684 Fax:62805284 E-mail: sawmkt@sipat.com
4. Reliability
4.1 Mechanical Shock: The components shall remain within the
electrical specifications after 1000 shocks, acceleration 392m/s2,
duration 6 milliseconds..
4.2 Vibration Fatigue: The components shall remain within the
electrical specifications after
loaded vibration at 10~120 Hz, amplitude 1.5 mm, X,Y,Z, direction,
for 2 hours.
4.3 Terminal Strength: The components shall remain within the
electrical specifications after
pulled 2 kgs weight for 10 seconds towards an axis of each terminal.
4.4 High Temperature Storage: The components shall remain within
the electrical specifications
after being kept at the 85 ±2 for 960 hours, then kept at room
℃℃
temperature for 2 hours.
4.5 Low Temperature Storage: The components shall remain within the
electrical specifications
after being kept at the -25 ±2
for 960 hours, then kept at room
℃℃
temperature for 2 hours.
4.6 Temperature Cycle: The components shall remain within the
electrical specifications after
5 cycles of high and low temperature testing ( one cycle: 80
for 30
minutes
25
for
→℃
5 minutes→-25 for 30 minutes )than kept at
room temperature for 2 hours.
4.7 Humidity Test: The components shall remain within the electrical
specifications after
being kept at the condition of ambient temperature 40±2 , and 90
95% RH for 960±5 hours, then kept at room temperature and normal
humidity for 1.5 hours.
4.8 Solder-heat Resistance: The components shall remain within the
electrical specifications
after dipped in the solder at 350 ±5 for 5±1 seconds, then kept at
℃℃
room temperature for 10 mins. (Terminal must be dipped leaving 1.5
mm from the case).
4.9 Solderability: Solderability of terminal shall be kept at more than
80% after dipped in
the solder flux at 230 ±5
for 5±1 seconds.
℃℃
4.10 Storage: The components shall meet the electrical and
mechanical specifications after
5 years storage, if stored within the temperature range of -20℃~
+60 and in the humidity of 20 to 60% r.h.


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