Electronic Components Datasheet Search |
|
SP959B01-TD01 Datasheet(PDF) 6 Page - List of Unclassifed Manufacturers |
|
SP959B01-TD01 Datasheet(HTML) 6 Page - List of Unclassifed Manufacturers |
6 / 7 page SIPAT Co.,Ltd www.sipatsaw.com China Electronics Technology Group Corporation No.26 Research Institute P.O. Box 2513 Chongqing, China 400060 Tel:+86-23-62920684 Fax:62805284 E-mail: sawmkt@sipat.com 4. Reliability 4.1 Mechanical Shock: The components shall remain within the electrical specifications after 1000 shocks, acceleration 392m/s2, duration 6 milliseconds.. 4.2 Vibration Fatigue: The components shall remain within the electrical specifications after loaded vibration at 10~120 Hz, amplitude 1.5 mm, X,Y,Z, direction, for 2 hours. 4.3 Terminal Strength: The components shall remain within the electrical specifications after pulled 2 kgs weight for 10 seconds towards an axis of each terminal. 4.4 High Temperature Storage: The components shall remain within the electrical specifications after being kept at the 85 ±2 for 960 hours, then kept at room ℃℃ temperature for 2 hours. 4.5 Low Temperature Storage: The components shall remain within the electrical specifications after being kept at the -25 ±2 for 960 hours, then kept at room ℃℃ temperature for 2 hours. 4.6 Temperature Cycle: The components shall remain within the electrical specifications after 5 cycles of high and low temperature testing ( one cycle: 80 for 30 ℃ minutes 25 for →℃ 5 minutes→-25 for 30 minutes )than kept at ℃ room temperature for 2 hours. 4.7 Humidity Test: The components shall remain within the electrical specifications after being kept at the condition of ambient temperature 40±2 , and 90 ℃ ~ 95% RH for 960±5 hours, then kept at room temperature and normal humidity for 1.5 hours. 4.8 Solder-heat Resistance: The components shall remain within the electrical specifications after dipped in the solder at 350 ±5 for 5±1 seconds, then kept at ℃℃ room temperature for 10 mins. (Terminal must be dipped leaving 1.5 mm from the case). 4.9 Solderability: Solderability of terminal shall be kept at more than 80% after dipped in the solder flux at 230 ±5 for 5±1 seconds. ℃℃ 4.10 Storage: The components shall meet the electrical and mechanical specifications after 5 years storage, if stored within the temperature range of -20℃~ +60 and in the humidity of 20 to 60% r.h. ℃ |
Similar Part No. - SP959B01-TD01 |
|
Similar Description - SP959B01-TD01 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |