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AM41DL3208G Datasheet(PDF) 2 Page - SPANSION |
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AM41DL3208G Datasheet(HTML) 2 Page - SPANSION |
2 / 65 page PRELIMINARY This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. Publication# 25870 Rev: A Amendment/0 Issue Date: February 13, 2002 Refer to AMD’s Website (www.amd.com) for the latest information. Am41DL3208G Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features I Power supply voltage of 2.7 to 3.3 volt I High performance — Access time as fast as 70 ns I Package — 73-Ball FBGA I Operating Temperature — –40°C to +85°C Flash Memory Features ARCHITECTURAL ADVANTAGES I Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in other bank — Zero latency between read and write operations I Flexible BankTM architecture — Read may occur in any of the three banks not being written or erased. — Four banks may be grouped by customer to achieve desired bank divisions. I Secured Silicon (SecSi) Sector: Extra 256 Byte sector — Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. — Customer lockable: Sector is one-time programmable. Once locked, data cannot be changed I Zero Power Operation — Sophisticated power management circuits reduce power consumed during inactive periods to nearly zero I Top or bottom boot block I Manufactured on 0.17 µm process technology I Compatible with JEDEC standards — Pinout and software compatible with single-power-supply flash standard PERFORMANCE CHARACTERISTICS I High performance — Access time as fast as 70 ns — Program time: 4 µs/word typical utilizing Accelerate function I Ultra low power consumption (typical values) — 2 mA active read current at 1 MHz — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode I Minimum 1 million write cycles guaranteed per sector I 20 Year data retention at 125°C — Reliable operation for the life of the system SOFTWARE FEATURES I Data Management Software (DMS) — AMD-supplied software manages data programming and erasing, enabling EEPROM emulation — Eases sector erase limitations I Supports Common Flash Memory Interface (CFI) I Unlock Bypass Program command — Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES I Any combination of sectors can be erased I Ready/Busy# output (RY/BY#) — Hardware method for detecting program or erase cycle completion I Hardware reset pin (RESET#) — Hardware method of resetting the internal state machine to reading array data I WP#/ACC input pin — Write protect (WP#) function allows protection of two outermost boot sectors, regardless of sector protect status — Acceleration (ACC) function accelerates program timing I Sector protection — Hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector — Temporary Sector Unprotect allows changing data in protected sectors in-system SRAM Features I Power dissipation — Operating: 30 mA maximum — Standby: 15 µA maximum I CE1s# and CE2s Chip Select I Power down features using CE1s# and CE2s I Data retention supply voltage: 1.5 to 3.3 volt I Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8) |
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