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LTM4632 Datasheet(PDF) 21 Page - Linear Technology |
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LTM4632 Datasheet(HTML) 21 Page - Linear Technology |
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21 / 28 page  LTM4632 21 4632fc For more information www.linear.com/LTM4632 APPLICATIONS INFORMATION SAFETY CONSIDERATIONS The LTM4632 modules do not provide galvanic isolation from VIN to VOUT. There is no internal fuse. If required, a slow blow fuse with a rating twice the maximum input current needs to be provided to protect each unit from catastrophic failure. The device does support thermal shutdown and over current protection. LAYOUT CHECKLIST/EXAMPLE The high integration of LTM4632 makes the PCB board layout very simple and easy. However, to optimize its electrical and thermal performance, some layout consid- erations are still necessary. • Use large PCB copper areas for high current paths, including VIN, GND, VOUT1 and VOUT2. It helps to mini- mize the PCB conduction loss and thermal stress. • Place high frequency ceramic input and output capac- itors next to the VIN, PGND and VOUT pins to minimize high frequency noise. • Place a dedicated power ground layer underneath the unit. • To minimize the via conduction loss and reduce mod- ule thermal stress, use multiple vias for interconnec- tion between top layer and other power layers. • Do not put via directly on the pad, unless they are capped or plated over. • Use a separated SGND ground copper area for com- ponents connected to signal pins. Connect the SGND to GND underneath the unit. • For parallel modules, tie the VOUT, VFB, and COMP pins together. Use an internal layer to closely con- nect these pins together. The TRACK pin can be tied a common capacitor for regulator soft-start. • Bring out test points on the signal pins for monitoring. Figure 18 gives a good example of the recommended layout. GND GND COUT COUT CIN CIN VIN VIN Figure 18. Recommend PCB Layout |
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