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LTM8056 Datasheet(PDF) 20 Page - Linear Technology |
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LTM8056 Datasheet(HTML) 20 Page - Linear Technology |
20 / 28 page LTM8056 20 8056fa For more information www.linear.com/LTM8056 A graphical representation of these thermal resistances is given in Figure 7. The blue resistances are contained within the µModule converter, and the green are outside. The die temperature of the LTM8056 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8056. The bulk of the heat flow out of the LTM8056 is through the bottom of the μModule converter and the BGA pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. 8056 F07 µMODULE CONVERTER JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION AMBIENT CASE (BOTTOM)-TO-BOARD RESISTANCE Figure 7 APPLICATIONS INFORMATION |
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