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SFH-4685 Datasheet(PDF) 9 Page - OSRAM GmbH |
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SFH-4685 Datasheet(HTML) 9 Page - OSRAM GmbH |
9 / 13 page Discontinued SFH 4685 2009-03-19 9 Recommended Solder Pad Empfohlenes Lötpaddesign Handling Indication: The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. / Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberfläche sollte so gering wie möglich gehalten werden. 1.7 verbesserte Wärmeableitung OHF02421 Solder resist Cu-Fläche > 16 mm Paddesign for improved Lötstopplack heat dissipation Padgeometrie für Cu-area 2 |
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