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MR16R1624GEG0 Datasheet(PDF) 11 Page - Samsung semiconductor

Part # MR16R1624GEG0
Description  Key Timing Parameters
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

MR16R1624GEG0 Datasheet(HTML) 11 Page - Samsung semiconductor

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Page 10
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Figure 3: 256Mb/288Mb base RIMM Module PCB Physical Dimensions
Physical Dimensions -1 ( For PCB )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
±0.127[±0.005].
133.35
±0.127[5.250±0.005]
45.00[1.772]
1.00[0.039]
5.68[0.2236]
11.50[0.453]
45.00[1.772]
78.175[3.078]
55.175
±0.08[2.172±0.003]
7.468[0.294]
4.50[0.177]
A-1
A-92
DETAIL A
DETAIL B
B-1
0.80
±0.10
0.15
±0.10
2.99
±0.05
[0.031
±0.004]
[0.006
±0.004]
[0.12
±0.002]
DETAIL A
3.00
±0.10
2.00
±0.10
DETAIL B
[0.12
±0.004]
[0.079
±0.004]
Min.4.88
[0.192]
R 1.00
1.00[0.039]
3.00[0.118]
6.35[0.25]
R 2.00
COMPONENT AREA
(A SIDE)
DIA 2.44
120.65[4.75]
COMPONENT AREA
(B SIDE)
4.00
±0.15
[0.157
±0.006]
Note : The gray area above represents the contact surface of the heat spreader.
+
+
Min.6.35[0.25]
+
Heat spreader
B-92
8.60[0.339]
133.35
±0.127[5.250±0.005]
45.00[1.772]
1.00[0.039]
5.68[0.2236]
11.50[0.453]
45.00[1.772]
78.175[3.078]
55.175
±0.08[2.172±0.003]
7.468[0.294]
4.50[0.177]
A-1
A-92
DETAIL A
DETAIL B
B-1
0.80
±0.10
2.99
±0.05
[0.031
±0.004]
[0.12
±0.002]
DETAIL A
3.00
±0.10
2.00
±0.10
DETAIL B
[0.12
±0.004]
[0.079
±0.004]
Min.4.88
[0.192]
R 1.00
1.00[0.039]
3.00[0.118]
6.35[0.25]
R 2.00
COMPONENT AREA
(A SIDE)
DIA 2.44
120.65[4.75]
COMPONENT AREA
(B SIDE)
4.00
±0.15
[0.157
±0.006]
Note : The gray area above represents the contact surface of the heat spreader.
+
+
Min.6.35[0.25]
+
Heat spreader
B-92
8.60[0.339]
Min.6.35[0.25]
Min.6.35[0.25]


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