UJA1061TW datasheet(2/81 Pages) PHILIPS

Part #	UJA1061TW

Description	Low speed CAN/LIN system basis chip

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Manufacturer	PHILIPS [NXP Semiconductors]

Direct Link	http://www.nxp.com

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2004 Mar 22

2

Philips Semiconductors

Objective speciﬁcation

Low speed CAN/LIN system basis chip

UJA1061

CONTENTS

1

FEATURES

1.1

General

1.2

System features

1.3

Fail-safe features

1.4

CAN physical layer

1.5

LIN physical layer

2

GENERAL DESCRIPTION

3

ORDERING INFORMATION

4

BLOCK DIAGRAM

5

PINNING

6

FUNCTIONAL DESCRIPTION

6.1

Introduction

6.2

Fail-safe system controller

6.2.1

Fail-safe mode

6.2.2

Start-up mode

6.2.3

Restart mode

6.2.4

Normal mode

6.2.5

Standby mode

6.2.6

Sleep mode

6.2.7

Flash mode

6.3

On-chip oscillator

6.4

Watchdog

6.4.1

Watchdog start-up behaviour

6.4.2

Watchdog window behaviour

6.4.3

Watchdog time-out behaviour

6.4.4

Watchdog OFF behaviour

6.5

System reset

6.5.1

System reset pin RSTN

6.5.2

Enable output pin EN

6.6

Power supplies

6.6.1

Supported battery systems

6.6.2

Static and dynamic battery monitoring

6.6.3

Voltage regulators V1 and V2

6.6.4

Switched battery output (V3)

6.7

CAN transceiver

6.7.1

Mode control

6.7.2

Termination control

6.7.3

Bus, RXD and TXD failure detection

6.8

LIN transceiver

6.8.1

Mode control

6.8.2

Bus and TXDL failure detection

6.9

Inhibit output (pin INH)

6.10

Wake-up input (pin WAKE)

6.11

Interrupt output

6.12

Temperature protection

6.13

SPI interface

6.14

SPI register mapping

6.14.1

Register overview

6.14.2

Mode register

6.14.3

System status register

6.14.4

System diagnosis register

6.14.5

Interrupt enable register

6.14.6

Interrupt Enable Feedback register

6.14.7

Interrupt register

6.14.8

System configuration register

6.14.9

System Configuration Feedback register

6.14.10

Physical Layer Control register

6.14.11

Physical layer control feedback register

6.14.12

Special Mode register

6.14.13

General Purpose registers

6.14.14

General Purpose Feedback registers

6.15

Register configurations at reset

6.16

Test modes

6.16.1

Software development mode

6.16.2

Forced Normal mode

7

LIMITING VALUES

8

DC CHARACTERISTICS

9

AC CHARACTERISTICS

10

PACKAGE OUTLINE

11

SOLDERING

11.1

Introduction to soldering surface mount

packages

11.2

Reflow soldering

11.3

Wave soldering

11.4

Manual soldering

11.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

12

DATA SHEET STATUS

13

DEFINITIONS

14

DISCLAIMERS

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