NTQD6968

http://onsemi.com

6

INFORMATION FOR USING THE TSSOP–8 SURFACE MOUNT PACKAGE

RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to ensure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

mm

inches

0.038

0.95

0.252

6.4

0.018

0.45

0.026

0.65

0.177

4.5

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100

°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference shall be a maximum of 10

°C.

• The soldering temperature and time shall not exceed

260

°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient shall be 5

°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied

during cooling.

* * Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

* * Due to shadowing and the inability to set the wave

height to incorporate other surface mount components, the

D2PAK is not recommended for wave soldering.