ZXMN4A06G

ISSUE 1 - MAY 2002

2

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

V

DSS

40

V

Gate-Source Voltage

V

GS

20

V

Continuous Drain Current V

V

V

I

D

7.0

5.6

5.0

A

Pulsed Drain Current (c)

I

DM

22

A

Continuous Source Current (Body Diode) (b)

I

S

5.4

A

Pulsed Source Current (Body Diode)(c)

I

SM

22

A

Power Dissipation at T

Linear Derating Factor

P

D

2.0

16

W

mW/°C

Power Dissipation at T

Linear Derating Factor

P

D

3.9

31

W

mW/°C

Operating and Storage Temperature Range

T

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

62.5

°C/W

Junction to Ambient (b)

32.2

°C/W

THERMAL RESISTANCE

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 5 secs.

(c) Repetitive rating 25mm x 25mm FRA PCB, D=0.05 pulse width = 10 s - pulse width limited by maximum junction temperature.