II. Manufacturing Information

A. Description/Function:

4-Pin SC70 Microprocessor Reset Circuits with Manual Reset Input

B. Process:

S8

C. Number of Device Transistors:

380

D. Fabrication Location:

Oregon, USA

E. Assembly Location:

Malaysia

F. Date of Initial Production:

April, 2001

III. Packaging Information

A. Package Type:

4-Lead SC70

B. Lead Frame:

Alloy 42

C. Lead Finish:

Solder Plate

D. Die Attach:

Non-Conductive Expoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-1601-0100

H. Flammability Rating:

Class UL94-V0

I.

Classification of Moisture Sensitivity per JEDEC standard JESD22-A112:

Level 1

IV. Die Information

A. Dimensions:

30 x 30 mils

B. Passivation:

C. Interconnect:

Aluminum/Copper/Silicon

D. Backside Metallization:

None

E. Minimum Metal Width:

.8 microns (as drawn)

F. Minimum Metal Spacing:

.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

Wafer Saw