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MT8LSDT3264AI Datasheet(PDF) 8 Page - Micron Technology |
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MT8LSDT3264AI Datasheet(HTML) 8 Page - Micron Technology |
8 / 24 page 256MB / 512MB (x64) 168-PIN SDRAM DIMMs 32,64 Meg x 64 SDRAM DIMMs Micron Technology, Inc., reserves the right to change products or specifications without notice. SD8_16C32_64x64AG_C.fm - Rev. C 11/02 8 ©2002, Micron Technology Inc. MAND INHIBIT or NOP. Starting at some point during this 100µs period and continuing at least through the end of this period, COMMAND INHIBIT or NOP com- mands should be applied. Once the 100µs delay has been satisfied with at least one COMMAND INHIBIT or NOP command having been applied, a PRECHARGE command should be applied. All device banks must then be precharged, thereby placing the device in the all banks idle state. Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO REFRESH cycles are complete, the SDRAM is ready for mode register programming. Because the mode register will power up in an unknown state, it should be loaded prior to applying any operational command. Mode Register Definition The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in Figure 5, Mode Register Definition Diagram, on page 8. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power. Mode register bits M0–M2 specify the burst length, M3 specifies the type of burst (sequential or inter- leaved), M4–M6 specify the CAS latency, M7 and M8 specify the operating mode, M9 specifies the write burst mode, and M10 and M11 are reserved for future use. The mode register must be loaded when all device banks are idle, and the controller must wait the speci- fied time before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation. Burst Length Read and write accesses to the SDRAM are burst ori- ented, with the burst length being programmable, as shown in Figure 5, Mode Register Definition Diagram, on page 8. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 1, 2, 4, or 8 locations are available for both the sequential and the interleaved burst types, and a full-page burst is available for the sequential type. The full-page burst is used in conjunction with the BURST TERMINATE command to generate arbitrary burst lengths. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached, as shown in the Burst Definition Table. The block is uniquely selected by A1– A9 when the burst length is set to two; A2–A9 when the burst length is set to four; and by A3–A9 when the burst length is set to eight. The remaining (least significant) address bit(s) is (are) used to select the starting loca- tion within the block. Full-page bursts wrap within the page if the boundary is reached, as shown in Table 7, Burst Definitions, on page 9. Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of the accesses within a burst is deter- mined by the burst length, the burst type, and the starting column adress, as shown in Table 7, Burst Def- initions, on page 9. Figure 5: Mode Register Definition |
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