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MT46H32M16 Datasheet(PDF) 1 Page - Micron Technology |
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MT46H32M16 Datasheet(HTML) 1 Page - Micron Technology |
1 / 3 page 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile DDR SDRAM Advance ‡ PDF: 09005aef818ff7c5/Source: 09005aef818ff7ae Micron Technology, Inc., reserves the right to change products or specifications without notice. MT46H32M16.fm - Rev. A 03/05 EN 1 ©2005 Micron Technology, Inc. All rights reserved. ‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. Mobile Double Data Rate (DDR) SDRAM MT46H32M16LF – 8 Meg x 16 x 4 Banks MT46H16M32LF – 4 Meg x 32 x 4 Banks For a complete data sheet, please refer to www.micron.com/mobileds. Features •VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR) architecture; two data accesses per clock cycle • Differential clock inputs (CK and CK#) • Commands entered on each positive CK edge • DQS edge-aligned with data for READs; center- aligned with data for WRITEs • Four internal banks for concurrent operation • Data masks (DM) for masking write data–one mask per byte • Programmable burst lengths: 2, 4, 8, 16 or full page • Concurrent auto precharge option is supported • Auto refresh and self refresh modes • 1.8V LVCMOS compatible inputs • On-chip temperature sensor to control refresh rate • Partial array self refresh (PASR) • Deep power-down (DPD) • Selectable output drive (DS) • Clock stop capability Notes:1. Only available for x16 configuration. 2. Only available for x32 configuration. Options Marking •VDD/VDDQ • 1.8V/1.8V H • Configuration • 32 Meg x 16(8 Meg x 16 x 4 banks) • 16 Meg x 32 (4 Meg x 32 x 4 banks) 32M16 16M32 •Plastic Package • 60-Ball VFBGA1 • 90-Ball VFBGA 2 TBD • Timing – Cycle Time •6ns @ CL = 3 • 7.5ns @ CL = 3 • 10ns @ CL = 3 -6 -75 -10 • Operating Temperature Range • Commercial (0° to +70°C) • Industrial (-40°C to +85°C) None IT Figure 1: 60-Ball VFBGA Assignment Table 1: Configuration Addressing Architecture 32 Meg x 16 16 Meg x 32 Configuration 8 Meg x 16 x 4 4 Meg x 32 x 4 Refresh Count 8K 8K Row Addressing 8K (A0–A12) 8K (A0–A12) Bank Addressing 4 (BA0, BA1) 4 (BA0, BA1) Column Addressing 1K (A0–A9) 512 (A0–A8) 1234 6789 5 A B C D E F G H J K VSSQ DQ14 DQ12 DQ10 DQ8 NC CK# A12 A8 A5 VSS VDDQ VSSQ VDDQ VSSQ VSS CKE A9 A6 VSS DQ15 DQ13 DQ11 DQ9 UDQS UDM CK A11 A7 A4 VDDQ DQ1 DQ3 DQ5 DQ7 A13, NC WE# CS# A10/AP A2 DQ0 DQ2 DQ4 DQ6 LDQS LDM CAS# BA0 A0 A3 VDD VSSQ VDDQ VSSQ VDDQ VDD RAS# BA1 A1 VDD |
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