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T436416A-10SG Datasheet(PDF) 3 Page - Taiwan Memory Technology

Part # T436416A-10SG
Description  4M X 16 SDRAM
Download  29 Pages
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Manufacturer  TMT [Taiwan Memory Technology]
Direct Link  http://www.tmtech.com.tw
Logo TMT - Taiwan Memory Technology

T436416A-10SG Datasheet(HTML) 3 Page - Taiwan Memory Technology

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TE
CH
tm
T436416A
TM Technology Inc. reserves the right
P. 3
Publication Date: MAY. 2003
to change products or specifications without notice.
Revision: B
PIN DESCRIPTION
PIN
NAME
INPUT FUNCTION
CLK
System Clock
Active on the positive going edge to sample all input.
CS
Chip Select
Disables or enables device operation by masking or enabling all input
except CLK,CKE and L(U)DQM
CKE
Clock Enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A11
Address
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11,column address : CA0 ~ CA7
BA0 ~ BA1
Bank Select Address
Selects bank to be activated during row address latch time.
Select bank for read/write during column address latch time.
RAS
Row Address Strobe
Latches row addresses on the positive going edge of the CLK
with
RAS low.
Enables row access & precharge.
CAS
Column Address Strobe
Latches column addresses on the positive going edge of the CLK
with
CAS low.
Enables column access .
WE
Write Enable
Enables write operation and row precharge.
Latches data in starting from
CAS , WE active.
L(U)DQM
Data Input/Output
Mask
Makes data output Hi-Z,
tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
DQ0 ~ DQ15
Data Input/Output
Data inputs/outputs are multiplexed on the same pins.
VDD/VSS
Power Supply/Ground Power and ground for the input buffers and the core logic.
VDDQ/VSSQ
Data Output
Power/Ground
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
N.C/RFU
No
Connection/Reserved
for Future Use
This pin is recommended to be left No Connection on the device.


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