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TLV2772IDGK Datasheet(PDF) 2 Page - Texas Instruments |
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TLV2772IDGK Datasheet(HTML) 2 Page - Texas Instruments |
2 / 32 page TLV2772, TLV2772A, TLV2772Y 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT DUAL OPERATIONAL AMPLIFIERS SLOS209 – JANUARY 1998 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2772Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2772. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – 1OUT 1IN + 1IN – VDD+ (8) (6) (3) (2) (5) (1) (7) (4) VDD – /GND + – 2OUT 2IN + 2IN – 51 49 (2) (3) (4) (5) (6) (7) (8) (1) |
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Similar Description - TLV2772IDGK |
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