TLV2772, TLV2772A, TLV2772Y

2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT

DUAL OPERATIONAL AMPLIFIERS

SLOS209 – JANUARY 1998

2

POST OFFICE BOX 655303

TLV2772Y chip information

This chip, when properly assembled, displays characteristics similar to the TLV2772. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

1OUT

1IN +

1IN –

VDD+

(8)

(6)

(3)

(2)

(5)

(1)

(7)

(4)

VDD – /GND

+

–

2OUT

2IN +

2IN –

51

49

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(1)