AD5424 datasheet(5/24 Pages) AD

Part #	AD5424

Description	8-/10-/12-Bit, High Bandwidth, Multiplying DACs with Parallel Interface

Download	24 Pages

Scroll/Zoom	100%

Manufacturer	AD [Analog Devices]

Direct Link	http://www.analog.com

Logo

5 / 24 page

REV. 0

AD5424/AD5433/AD5445

–5–

ABSOLUTE MAXIMUM RATINGS

1

(TA = 25 C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VREF, RFB to GND . . . . . . . . . . . . . . . . . . . . . . –12 V to +12 V

IOUT1, IOUT2 to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Logic Inputs and Output

2

. . . . . . . . . . . –0.3 V to VDD +0.3 V

Operating Temperature Range

Extended Industrial (Y Version) . . . . . . . . –40 C to +125 C

Storage Temperature Range . . . . . . . . . . . . . –65 C to +150 C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 C

16-Lead TSSOP JA Thermal Impedance . . . . . . . . . 150 C/W

20-Lead TSSOP JA Thermal Impedance . . . . . . . . . 143 C/W

20-Lead LFCSP JA Thermal Impedance . . . . . . . . . 135 C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300 C

IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235 C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 Overvoltages at DBx,

CS, and R/W, will be clamped by internal diodes.

IOL

200 A

IOH

200 A

CL

50pF

TO

OUTPUT

VOH (MIN) + VOL (MAX)

2

Figure 2. Load Circuit for Data Output Timing Specifications

ORDERING GUIDE

Resolution INL

Temperature

Package

Model

(Bits)

(LSB)

Range

Package Description

Option

AD5424YRU

8

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-16

AD5424YRU-REEL

8

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5424YRU-REEL7

8

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5424YCP

8

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5424YCP-REEL

8

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5424YCP-REEL7

8

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YRU

10

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YRU-REEL

10

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YRU-REEL7

10

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YCP

10

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YCP-REEL

10

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YCP-REEL7

10

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YRU

12

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YRU-REEL

12

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YRU-REEL7

12

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YCP

12

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YCP-REEL

12

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YCP-REEL7

12

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

EVAL-AD5424EB

Evaluation Kit

EVAL-AD5433EB

Evaluation Kit

EVAL-AD5445EB

Evaluation Kit

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD5424/AD5433/AD5445 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

Similar Part No. - AD5424

Manufacturer	Part #	Datasheet	Description
Analog Devices	AD5424	860Kb / 32P	Dual 8-,10-,12-Bit High Bandwidth Multiplying DACs with Serial Interface REV. 0
List of Unclassifed Man...	AD5424	88Kb / 5P	Quad 3-State Noninverting Buffers High-Performance Silicon-Gate CMOS
Analog Devices	AD5424	866Kb / 32P	8-/10-/12-Bit, High Bandwidth Multiplying DACs with Parallel Interface REV. B
	AD5424	584Kb / 20P	8-Bit, High Speed, Multiplying D/A Converter (Universal Digital Logic Interface) REV. C
	AD5424	753Kb / 25P	Dual 12-Bit, High Bandwidth, Multiplying DAC with 4-Quadrant Resistors and Parallel Interface REV. B

More results

Similar Description - AD5424

Manufacturer	Part #	Datasheet	Description
Analog Devices	AD5424	1,006Kb / 29P	8-/10-/12-Bit, High Bandwidth Multiplying DACs with Parallel Interface REV. D
	AD5433	1,006Kb / 29P	8-/10-/12-Bit, High Bandwidth Multiplying DACs with Parallel Interface REV. D
	AD5445	1,006Kb / 29P	8-/10-/12-Bit, High Bandwidth Multiplying DACs with Parallel Interface Rev. D
	AD5424	866Kb / 32P	8-/10-/12-Bit, High Bandwidth Multiplying DACs with Parallel Interface REV. B
	AD5447	904Kb / 33P	Dual 8-/10-/12-Bit, High Bandwidth, Multiplying DACs with Parallel Interface REV. C
	AD5440	717Kb / 32P	Dual 8-/10-/12-Bit, High Bandwidth, Multiplying DACs with Parallel Interface REV. C
	AD5428	904Kb / 33P	Dual 8-/10-/12-Bit, High Bandwidth, Multiplying DACs with Parallel Interface REV. C
	AD5440	904Kb / 33P	Dual 8-/10-/12-Bit, High Bandwidth, Multiplying DACs with Parallel Interface REV. C
	AD5432	987Kb / 25P	8-/10-/12-Bit High Bandwidth Multiplying DACs with Serial Interface Rev. G
	AD5443	987Kb / 25P	8-/10-/12-Bit High Bandwidth Multiplying DACs with Serial Interface Rev. G

More results

AD5424 Datasheet(PDF) 5 Page - Analog Devices

AD5424 Datasheet(HTML) 5 Page - Analog Devices

Similar Part No. - AD5424

Similar Description - AD5424

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Datasheet Download

Link URL