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MAX3345EEBE-T Datasheet(PDF) 11 Page - Maxim Integrated Products |
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MAX3345EEBE-T Datasheet(HTML) 11 Page - Maxim Integrated Products |
11 / 15 page IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and per- formance of finished equipment; it does not specifically refer to integrated circuits. The MAX3344E/MAX3345E help the user design equipment that meets level 4 of IEC 1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is a higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with- stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 1c shows the IEC 1000-4-2 model. The Air-Gap Discharge Method involves approaching the device with a charged probe. The Contact Discharge Method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufactur- ing. All pins require this protection during manufactur- ing. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. Applications Information External Components External Resistors Two external 23.7Ω ±1% to 27.4Ω ±1%, 1/2W resistors are required for USB connection. Place the resistors in between the MAX3344E/MAX3345E and the USB connector on the D+ and D- lines (see the Typical Operating Circuit). External Capacitors Use three external capacitors for proper operation. Use a 0.1µF ceramic for decoupling VL, a 1µF ceramic for decoupling VCC, and a 1.0µF (min) ceramic or plastic filter capacitor on VTRM. Return all capacitors to GND. UCSP Applications Information For the latest application details on UCSP construction, dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, refer to the Application Note UCSP—A Wafer-Level Chip-Scale Package available on Maxim’s website at www.maxim-ic.com/ucsp. ±15kV ESD-Protected USB Transceivers in UCSP with USB Detect ______________________________________________________________________________________ 11 Chip Information TRANSISTOR COUNT: 2162 PROCESS: BiCMOS |
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