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MIC5259-2.5YD5 Datasheet(PDF) 3 Page - Micrel Semiconductor |
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MIC5259-2.5YD5 Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 9 page MIC5259 Micrel, Inc. May 2005 3 M9999-051305 Electrical Characteristics(5) VIN = VOUT + 1V, VEN = VIN; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Symbol Parameter Conditions Min Typical Max Units VO Output Voltage Accuracy IOUT = 100µA –1.5 1.5 % –3 3 % ΔVLNR Line Regulation VIN = VOUT + 1V to 6V –0.3 0.02 0.3 %/V ΔVLDR Load Regulation IOUT = 0.1mA to 300mA(6) 0.6 3.0 % VIN – VOUT Dropout Voltage(7) IOUT = 150mA 150 mV IOUT = 300mA 300 500 mV 550 mV IQ Quiescent Current VEN ≤ 0.4V (shutdown) 0.2 1 µA IGND Ground Pin Current(8) IOUT = 0mA 105 150 µA IOUT = 300mA 120 250 µA PSRR Ripple Rejection; IOUT = 150mA f = 10Hz, COUT = 1.0µF, CBYP = 0.01µF 65 dB f = 10Hz, VIN = VOUT + 0.3V 53 dB f = 10kHz, VIN = VOUT + 0.3V 53 dB ILIM Current Limit VOUT = 0V 350 475 mA en Output Voltage Noise COUT = 1.0µF, CBYP = 0.01µF, 30 µV(rms) f = 10Hz to 100kHz Enable Input VIL Enable Input Logic-Low Voltage VIN = 2.7 to 5.5V, regulator shutdown 0.4 V VIH Enable Input Logic-High Voltage VIN = 2.7V to 5.5V, regulator enabled 1.6 V IEN Enable Input Current VIL ≤ 0.4V, regulator shutdown 0.01 1 µA VIH ≥ 1.6V, regulator enabled 0.01 1 µA Shutdown Resistance Discharge 500 Ω Thermal Protection Thermal Shutdown Temperature 150 °C Thermal Shutdown Hysteresis 10 °C Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max)–TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJA of the MIC5259-x.xBM5 (all ver- sions) is 235°C/W on a PC board. See “Thermal Considerations” section for further details. 4. Devices are ESD sensitive. Handling precautions recommended. 5. Specification for packaged product only. 6. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 300mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differen- tial. For outputs below 2.7V, dropout voltage is the input-to-output voltage differential with the minimum input voltage 2.7V. Minimum input operating voltage is 2.7V. 8. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin cur- rent. Absolute Maximum Ratings(1) Supply Input Voltage (VIN)....................................0V to +7V Enable Input Voltage (VEN) ..................................0V to +7V Power Dissipation (PD)..........................Internally Limited(3) Junction Temperature (TJ)........................ –40°C to +125°C Storage Temperature(TS) ......................... –65°C to +150°C Lead Temperature (soldering, 5 sec.)........................ 260°C ESD(4)............................................................................ 2kV Operating Ratings(2) Input Voltage (VIN).......................................... +2.7V to +6V Enable Input Voltage (VEN) ...................................0V to VIN Junction Temperature (TJ)........................ –40°C to +125°C Thermal Resistance ThinSOT™-23 (θJA)...........................................235°C/W 2mm × 2mm MLF™ (θJA) ....................................90°C/W |
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