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UPC37M32TJ Datasheet(PDF) 9 Page - NEC

Part # UPC37M32TJ
Description  BIPOLAR ANALOG INTEGRATED CIRCUIT
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
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UPC37M32TJ Datasheet(HTML) 9 Page - NEC

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Data Sheet G16444EJ1V0DS
9
µµµµPC37M31,37M32
RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the
µPC37M31 and 37M32.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
Type of Surface Mount Device
µµµµ PC37M31TJ, µµµµ PC37M32TJ: MP-3Z (5-pin)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflows processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflows processes: 3 times or less.
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µµµµ PC37M31HB, µµµµ PC37M32HB: MP-3 (5-pin)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.


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