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UPC37M32TJ Datasheet(PDF) 9 Page - NEC |
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UPC37M32TJ Datasheet(HTML) 9 Page - NEC |
9 / 11 page Data Sheet G16444EJ1V0DS 9 µµµµPC37M31,37M32 RECOMMENDED MOUNTING CONDITIONS The following conditions must be met for mounting conditions of the µPC37M31 and 37M32. For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E). Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under different conditions. Type of Surface Mount Device µµµµ PC37M31TJ, µµµµ PC37M32TJ: MP-3Z (5-pin) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflows processes: 3 times or less. IR35-00-3 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflows processes: 3 times or less. VP15-00-3 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µµµµ PC37M31HB, µµµµ PC37M32HB: MP-3 (5-pin) Process Conditions Wave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each pin). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. |
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