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ADS5440IPFPR Datasheet(PDF) 2 Page - Texas Instruments |
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ADS5440IPFPR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 11 page www.ti.com ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS (1) ADS5440 SLAS467 – JULY 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION(1) Product Package- Package Specified Package Ordering Transport Lead Designator (1) Temperature Marking Number Media, Range Quantity ADS5440 HTQFP-80(2) PFP –40 °C to 85°C ADS5440I ADS5440IPFP Tray, 96 PowerPAD ADS5440IPFPR Tape and Reel, 1000 (1) For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Thermal pad size: 7,5 mm x 7,5 mm (typ) over operating free-air temperature range (unless otherwise noted)(1) VALUE / UNIT AVDD to GND 6 V Supply voltage DRVDD to GND 5 V Analog input to GND –0.3 V to AVDD+0.3 V Clock input to GND –0.3 V to AVDD+0.3 V CLK to CLK ±2.5 Digital data output to GND –0.3 V to DRVDD+0.3 V Operating temperature range –40 °C to 85°C Maximum junction temperature 150 °C Storage temperature range –65 °C to 150°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those specified is not implied. PARAMETER TEST CONDITIONS TYP UNIT Soldered slug, no airflow 21.7 °C/W Soldered slug, 250-LFPM airflow 15.4 °C/W θ JA Unsoldered slug, no airflow 50 °C/W Unsoldered slug, 250-LFPM airflow 43.4 °C/W θ JC Bottom of package (heatslug) 2.99 °C/W (1) Using 36 thermal vias (6 x 6 array). See the Application Section. 2 |
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