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ADS5440IPFPR Datasheet(PDF) 2 Page - Texas Instruments

Part # ADS5440IPFPR
Description  13-BIT 210 MSPS ANALOG-TO-DIGITAL CONVERTER
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ADS5440IPFPR Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
(1)
ADS5440
SLAS467 – JULY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION(1)
Product
Package-
Package
Specified
Package
Ordering
Transport
Lead
Designator (1)
Temperature
Marking
Number
Media,
Range
Quantity
ADS5440
HTQFP-80(2)
PFP
–40
°C to 85°C
ADS5440I
ADS5440IPFP
Tray, 96
PowerPAD
ADS5440IPFPR
Tape and Reel, 1000
(1)
For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet.
(2)
Thermal pad size: 7,5 mm x 7,5 mm (typ)
over operating free-air temperature range (unless otherwise noted)(1)
VALUE / UNIT
AVDD to GND
6 V
Supply voltage
DRVDD to GND
5 V
Analog input to GND
–0.3 V to AVDD+0.3 V
Clock input to GND
–0.3 V to AVDD+0.3 V
CLK to CLK
±2.5
Digital data output to GND
–0.3 V to DRVDD+0.3 V
Operating temperature range
–40
°C to 85°C
Maximum junction temperature
150
°C
Storage temperature range
–65
°C to 150°C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond
those specified is not implied.
PARAMETER
TEST CONDITIONS
TYP
UNIT
Soldered slug, no airflow
21.7
°C/W
Soldered slug, 250-LFPM airflow
15.4
°C/W
θ
JA
Unsoldered slug, no airflow
50
°C/W
Unsoldered slug, 250-LFPM airflow
43.4
°C/W
θ
JC
Bottom of package (heatslug)
2.99
°C/W
(1)
Using 36 thermal vias (6 x 6 array). See the Application Section.
2


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