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MAX3208EAUB Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX3208EAUB
Description  Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX3208EAUB Datasheet(HTML) 2 Page - Maxim Integrated Products

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Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Parameters are 100% production tested at +25°C. Limits over temperature are guaranteed by design only.
Note 2: Idealized clamp voltages. See the Applications Information section for more information.
Note 3: Guaranteed by design, not production tested.
VCC to GND ...........................................................-0.3V to +6.0V
I/O_ to GND ................................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23 (derate 8.7mW/°C above +70°C)............696mW
9-Pin UCSP (derate 4.7mW/°C above +70°C) .............379mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
16-Pin Thin QFN (derate 20.8mW/°C above +70°C) .1667mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
0.9
5.5
V
Supply Current
ICC
1
100
nA
Diode Forward Voltage
VF
IF = 10mA
0.65
0.95
V
Positive transients
VCC + 25
TA = +25°C, ±15kV Human
Body Model, IF = 10A
Negative transients
-25
Positive transients
VCC + 60
TA = +25°C, ±8kV Contact
Discharge (IEC 61000-4-2),
IF = 24A
Negative transients
-60
Positive transients
VCC + 100
Channel Clamp Voltage
(Note 2)
VC
TA = +25°C, ±15kV Air-Gap
Discharge (IEC 61000-4-2),
IF = 45A
Negative transients
-100
V
Channel Leakage Current
-0.1
+0.1
µA
MAX3205EABL-T
MAX3207EAUT
2.5
3
MAX3205EATE
MAX3208EATE
2.7
3.2
Channel I/O Capacitance
VCC = +3.3V, bias of VCC / 2
MAX3208EAUB
2.6
3.1
pF
Channel I/O to I/O
Variation in Capacitance
∆CIN
VCC = +3.3V, bias of VCC / 2, CI/O_ to GND
±0.05
pF
TRANSIENT SUPPRESSOR
VCC Capacitance to GND
10
pF
ESD Trigger Voltage
dV/dt
1V/ns (Note 3)
9
V


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