NL17SZ06

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6

PACKAGE DIMENSIONS

SOT−553

XV5 SUFFIX

5−LEAD PACKAGE

CASE 463B−01

ISSUE A

STYLE 1:

PIN 1. BASE 1

2. EMITTER 1/2

3. BASE 2

4. COLLECTOR 2

5. COLLECTOR 1

STYLE 2:

PIN 1. CATHODE

2. ANODE

3. CATHODE

4. CATHODE

5. CATHODE

1.35

0.0531

0.5

0.0197

mm

inches

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

G

M

0.08 (0.003)

X

C

J

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

DIM

A

MIN

MAX

MIN

MAX

INCHES

1.50

1.70

0.059

0.067

MILLIMETERS

B

1.10

1.30

0.043

0.051

C

0.50

0.60

0.020

0.024

D

0.17

0.27

0.007

0.011

G

0.50 BSC

0.020 BSC

J

0.08

0.18

0.003

0.007

K

S

A

B

Y

12

3

4

5

S

K

0.004

0.012

0.059

0.067

0.10

0.30

1.50

1.70

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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NL17SZ06/D

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