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BLF861A Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BLF861A
Description  UHF power LDMOS transistor
Download  16 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BLF861A Datasheet(HTML) 2 Page - NXP Semiconductors

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2001 Feb 09
2
Philips Semiconductors
Product specification
UHF power LDMOS transistor
BLF861A
FEATURES
• High power gain
• Easy power control
• Excellent ruggedness
• Designed to withstand abrupt load mismatch errors
• Source on underside eliminates DC isolators; reducing
common mode inductance
• Designed for broadband operation (UHF band)
• Internal input and output matching for high gain and
optimum broadband operation.
APPLICATIONS
• Communication transmitter applications in the UHF
frequency range.
DESCRIPTION
Silicon N-channel enhancement mode lateral D-MOS
push-pull transistor in a SOT540A package with ceramic
cap. The common source is connected to the mounting
flange.
PINNING - SOT540A
PIN
DESCRIPTION
1
drain 1
2
drain 2
3
gate 1
4
gate 2
5
source connected to flange
5
12
4
3
Top view
MBK777
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Th =25 °C in a common source 860 MHz test circuit.
Note
1. Sync compression: input sync
≥ 33%; output sync 27%.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
MODE OF OPERATION
f
(MHz)
VDS
(V)
PL
(W)
Gp
(dB)
η
D
(%)
∆G
p
(dB)
CW, class-AB
860
32
150
>13.5
typ. 14.5
>50
≤1
PAL BG (TV); class-AB
860 (ch 69)
32
>150
typ. 170
(peak sync)
>14
>40
note 1
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
65
V
VGS
gate-source voltage
−±15
V
ID
drain current (DC)
18
A
Ptot
total power dissipation
Tmb ≤ 25 °C
318
W
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
200
°C


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