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K9F1G08R0A Datasheet(PDF) 1 Page - Samsung semiconductor

Part # K9F1G08R0A
Description  128M x 8 Bit / 256M x 8 Bit NAND Flash Memory
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

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1
K9F1G08U0A
K9F1G08R0A
K9K2G08U1A
FLASH MEMORY
Document Title
128M x 8 Bit / 256M x 8 Bit NAND Flash Memory
Revision History
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near your office.
Revision No
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Remark
Advance
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
History
1. Initial issue
1. The tADL(Address to Data Loading Time) is added.
- tADL Minimum 100ns (Page 11, 23~26)
- tADL is the time from the WE rising edge of final address cycle
to the WE rising edge of first data cycle at program operation.
2. Added Addressing method for program operation
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(TSOP1, WSOP1) Dimension Change
1. Technical note is changed
2. Notes of AC timing characteristics are added
3. The description of Copy-back program is changed
4. Voltage range is changed
-1.7V~1.95V -> 1.65V~1.95V
5. Note2 of Command Sets is added
1. CE access time : 23ns->35ns (p.11)
1. The value of tREA for 3.3V device is changed.(18ns->20ns)
2. EDO mode is added.
1. The flow chart to creat the initial invalid block table is cahnged.
Draft Date
Aug. 24. 2003
Jan. 27. 2004
Apr. 23. 2004
May. 19. 2004
Jan. 21. 2005
Feb. 14. 2005
May. 24. 2005
May 6. 2005


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