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TL497AY Datasheet(PDF) 3 Page - Texas Instruments |
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TL497AY Datasheet(HTML) 3 Page - Texas Instruments |
3 / 11 page TL497AC, TL497AI, TL497AY SWITCHING VOLTAGE REGULATORS SLVS009C – JUNE 1976 – REVISED AUGUST 1995 4–3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL497AY chip information This chip, when properly assembled, displays characteristics similar to the TL497AC. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS FREQ CONTROL COMP INPUT SUBSTRATE CATHODE CUR LIM SENS BASE DRIVE† BASE† GND V CC TL497AY COL OUT EMIT OUT ANODE (13) (12) (11) (3) (2) (1) (4) (6) (8) (7) (10) (14) (5) CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax= 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS INHIBIT 68 115 † BASE (11) and BASE DRIVE (12) are used for device testing only. They are not normally used in circuit applications of the device. (1) (2) (3) (4) (5) (6) (7) (8) (14) (10) (11) (12) (13) |
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