Exposed Pad RF/Thermal Considerations

The exposed paddle (EP) of the MAX9996’s 20-pin thin

QFN-EP package provides a low thermal-resistance

path to the die. It is important that the PC board on

which the MAX9996 is mounted be designed to con-

duct heat from the EP. In addition, provide the EP with a

low-inductance path to electrical ground. The EP MUST

be soldered to a ground plane on the PC board, either

directly or through an array of plated via holes.

Chip Information

TRANSISTOR COUNT: 1414

PROCESS: SiGe BiCMOS

SiGe High-Linearity, 1700MHz to 2200MHz

Downconversion Mixer with LO Buffer/Switch

10

______________________________________________________________________________________

COMPONENT

VALUE

DESCRIPTION

L1, L2

470nH

Wire-wound high-Q inductors (0805)

L3

10nH

Wire-wound high-Q inductor (0603)

C1

4pF

Microwave capacitor (0603)

C4

10pF

Microwave capacitor (0603)

C2, C6, C7, C8, C10, C12

22pF

Microwave capacitors (0603)

C3, C5, C9, C11

0.01

µF

Microwave capacitors (0603)

C13, C14

150pF

Microwave capacitors (0603)

C15

150pF

Microwave capacitor (0402)

R1

806

Ω±1% resistor (0603)

R2

549

Ω±1% resistor (0603)

R3

7.15

Ω±1% resistor (1206)

T1

4:1 balun

IF balun

U1

MAX9996

Maxim IC

Table 1. Component List Referring to the Typical Application Circuit

Pin Configuration/Functional Diagram

MAX9996

1

2

3

4

5

15

14

13

12

11

6

7

89

10

20

19

18

17

16

GND

TAP

RF

GND

GND

LO2

GND

LO1