ZXMP6A13G

ISSUE 2 - JULY 2004

7

Europe

Zetex GmbH

Streitfeldstraße 19

D-81673 München

Germany

Telefon: (49) 89 45 49 49 0

Fax: (49) 89 45 49 49 49

europe.sales@zetex.com

Americas

Zetex Inc

700 Veterans Memorial Hwy

Hauppauge, NY 11788

USA

Telephone: (1) 631 360 2222

Fax: (1) 631 360 8222

usa.sales@zetex.com

Asia Pacific

Zetex (Asia) Ltd

3701-04 Metroplaza Tower 1

Hing Fong Road, Kwai Fong

Hong Kong

Telephone: (852) 26100 611

Fax: (852) 24250 494

asia.sales@zetex.com

Corporate Headquarters

Zetex Semiconductors plc

Lansdowne Road, Chadderton

Oldham, OL9 9TY

United Kingdom

Telephone (44) 161 622 4444

Fax: (44) 161 622 4446

hq@zetex.com

These offices are supported by agents and distributors in major countries world-wide.

This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced

for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company

reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.

For the latest product information, log on to www.zetex.com

© Zetex Semiconductors plc 2004

PAD LAYOUT DETAILS

PACKAGE OUTLINE

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min

Max

Min

Max

Min

Max

Min

Max

A

-

1.80

-

0.071

e

2.30 BSC

0.0905 BSC

A1

0.02

0.10

0.0008

0.004

e1

4.60 BSC

0.181 BSC

b

0.66

0.84

0.026

0.033

E

6.70

7.30

0.264

0.287

b2

2.90

3.10

0.114

0.122

E1

3.30

3.70

0.130

0.146

C

0.23

0.33

0.009

0.013

L

0.90

-

0.355

-

D

6.30

6.70

0.248

0.264

-

----

PACKAGE DIMENSIONS