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LXHL-DB09 Datasheet(PDF) 8 Page - List of Unclassifed Manufacturers |
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LXHL-DB09 Datasheet(HTML) 8 Page - List of Unclassifed Manufacturers |
8 / 16 page Luxeon III Emitter DS45 (3/05) 8 Electrical Characteristics at 1400mA, Junction Temperature, TJ = 25ºC Table 10. T Te em mp pe erra attu urre e C Co oe effffiic ciie en ntt o off T Th he errm ma all F Fo orrw wa arrd d R Re es siis stta an nc ce e,, D Dy yn na am miic c V Vo olltta ag ge e[[33]] J Ju un nc cttiio on n F Fo orrw wa arrd d V Vo olltta ag ge e V V F F ((V V))[[11]] R Re es siis stta an nc ce e[[22]] ((m mV V//ooC C)) tto o C Ca as se e C Co ollo orr M Miin n.. T Ty yp p.. M Ma ax x.. ((Ω Ω)) R R D D ∆∆VV F F / / ∆∆TT J J ((ooC C//W W)) R R θθ J J C C Red 2.31 2.95 3.51 0.7 2.0 6 RedOrange 2.31 2.95 3.51 0.7 2.0 6 Amber 2.31 2.95 3.51 0.7 2.0 6 Notes for Table 10: 1. Lumileds maintains a tolerance of ± 0.06V on forward voltage measurements. 2. Dynamic resistance is the inverse of the slope in linear forward voltage model for LEDs. See Figure 3. 3. Measured between 25ºC ≤ T J ≤ 110ºC at I F = 1400mA. Absolute Maximum Ratings Table 11. W Wh hiitte e//G Grre ee en n// R Re ed d// C Cy ya an n//B Bllu ue e// R Re ed d O Orra an ng ge e// P Pa arra am me ette err R Ro oy ya all B Bllu ue e A Am mb be err DC Forward Current (mA) [1] 1000 1540 Peak Pulsed Forward Current (mA) 1000 2200 Average Forward Current (mA) 1000 1400 LED Junction Temperature (ºC) 135 135 Storage Temperature (ºC) 40 to +120 40 to +120 Soldering Temperature (ºC) [2] 260 for 260 for 5 seconds max 5 seconds max ESD Sensitivity [3] ±16,000V HBM ±16,000V HBM Notes for Table 11: 1. Proper current derating must be observed to maintain junction temperature below the maximum. For more information, consult the Luxeon Design Guide, available upon request. 2. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120ºC. Luxeon Emitters cannot be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective heating of the leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and the board is required. Please consult Lumileds' Application Brief AB10 on Luxeon Emitter Assembly Information for further details on assembly methods. 3. LEDs are not designed to be driven in reverse bias. Please consult Lumileds' Application Brief AB11 for further information. |
Similar Part No. - LXHL-DB09 |
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Similar Description - LXHL-DB09 |
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