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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS1M32-XXX
1Mx32 SRAM MODULE
FEATURES
■ Access Times of 17, 20, 25ns
■ Packaging
84 lead, 28mm CQFP, (Package 511)
66 pin PGA Type, 1.385" sq., Hermetic Ce-
ramic HIP
(Package 402)*
■ Organized as two banks of 512Kx32, User
Configurable as 2Mx16 or 4Mx8
* Packagetobedeveloped.
■ Commercial, Industrial and Military Temperature
Ranges
■ TTL Compatible Inputs and Outputs
■ 5 Volt Power Supply
■ Low Power CMOS
■ Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
■ Weight
WS1M32-XH2X* - 13 grams (typical)
WS1M32-XG3X - 20 grams (typical)
July 2002 Rev. 4
PIN DESCRIPTION
PIN CONFIGURATION FOR WS1M32-XH2X*
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
OE2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE1
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
CS2
A8
A9
I/O16
I/O17
I/O18
VCC
OE4
WE4
I/O27
A3
A4
A5
WE3
OE3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
BLOCK DIAGRAM
TOP VIEW
I/O0-31 DataInputs/Outputs
A0-18
AddressInputs
WE1-4
WriteEnables
CS1-2
ChipSelects
OE1-4
OutputEnable
VCC
PowerSupply
GND
Ground
NC
NotConnected
8
I/O0-7
CS1
I/O8-15
CS2
I/O16-23
I/O24-31
A0-18
WE1
8
2M x 8
8
512K x 8
8
512K x 8
2M x 8
512K x 8
512K x 8
2M x 8
512K x 8
512K x 8
2M x 8
512K x 8
512K x 8
OE1
WE2
OE2
WE3
OE3
WE4
OE4
NOTE: CS1& CS2 are used as bank select
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