PACKAGING INFORMATION

Rev. C

06/13/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Plastic TSOP-Type I

Package Code: T (32-pin)

D

SEATING PLANE

B

e

C

1

N

E

A1

A

S

H

L

α

Notes:

1. Controlling dimension: millimeters, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect

to one another within 0.004 inches at the

seating plane.

MILLIMETERS

INCHES

Symbol

Min.

Max.

Min.

Max.

No. Leads

32

A

—

1.20

—

0.047

A1

0.05

0.25

0.002

0.010

B

0.17

0.23

0.007

0.009

C

0.12

0.17

0.005

0.007

D

7.90

8.10

0.311

0.319

E

18.30

18.50

0.720

0.728

H

19.80

20.20

0.780

0.795

e

0.50 BSC

0.020 BSC

L

0.40

0.60

0.016

0.024

α

0°

8°

0°

8°

S

0.25 REF

0.010 REF