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HD66702R Datasheet(PDF) 11 Page - Hitachi Semiconductor |
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HD66702R Datasheet(HTML) 11 Page - Hitachi Semiconductor |
11 / 97 page HD66727 11 HD66727 Mounting Variations and Key-Matrix Configurations R C C COB board LCD glass LCD glass R C C Heat seal Heat seal LCD glass Chip R C C TCP Key-matrix board Key-matrix board Key-matrix board (1) COB-1 (3) TCP (2) COB-2 Chip ON F1 F2 123 456 789 ∗ 0 # ON F1 F2 123 456 789 ∗ 0 # ON F1 F2 123 456 789 ∗ 0 # LCD glass Chip R C C Heat seal Key-matrix board (4) COG ON F1 F2 123 456 789 ∗ 0 # Chip Figure 1 HD66727 Mounting Variations Table 2 Configurations of LCD Modules (LCM) with Key Scan Function for Different Mounting Methods Parts Chip-on-Board (COB) Mounting 1 Chip-on-Board (COB) Mounting 2 Tape-Carrier- Package (TCP) Mounting Chip-on-Glass (COG) Mounting LCD glass Necessary Necessary Necessary Necessary LCM (COB) substrate Necessary Not necessary Not necessary Not necessary HD66727 package Bare chip Bare chip TCP Bumped chip Heat seal Necessary Necessary Optional Necessary Key matrix substrate Necessary Necessary Necessary Necessary |
Similar Part No. - HD66702R |
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Similar Description - HD66702R |
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