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KAB02D100M-TLGP Datasheet(PDF) 1 Page - Samsung semiconductor |
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KAB02D100M-TLGP Datasheet(HTML) 1 Page - Samsung semiconductor |
1 / 72 page KAB0xD100M - TxGP Revision 1.11 August 2003 - 1 - MCP MEMORY SEC Only Document Title Multi-Chip Package MEMORY 64M Bit (8Mx8/4Mx16) Dual Bank NOR Flash / 128M Bit (8Mx16) NAND Flash / 32M Bit (2Mx16) UtRAM Revision History The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. Revision No. 0.0 0.1 0.2 0.3 1.0 1.1 1.11 Remark Preliminary Preliminary Preliminary Final Final Final Final History Initial Draft Inserted No ECC condition in NAND Flash • Endurance (1page) : 1,000 Program/Erase Cycles Maximum without ECC • Program Flow (39page) : Excluded "Read Verify" step after programming in this condition <Common> Revised TBIAS(43page) • from "-25 to 85" to "-40 to 125" Revised VIL(43page) • from max. 0.6V to max. 0.5V Revised VOH(43page) • from min. 2.4V to min. 2.3V Revised IOL(43page) • from 0.1mA to max. 2.1mA Revised IOH(43page) • from -0.1mA to max. -1.0mA <NAND> Revised the internal voltage that disables all functions(37page) • from 2V to 1.3V Revised power-up and power-down recovery time(37page) • from min. 1µs to min. 10µs Revised write cycle time(tWC)(59page) • from 50ns to min. 45ns Combined ALE to RE Delay in ID read and in Read cycle(59page) • from min. 20ns and 50ns to min. 10ns Revised RE Access Time(tREA)(59page) • from max. 35ns to max. 30ns Excluded min. value of RE High to Output Hi-Z(tREH)(59page) Inserted RE or CEF High to Output Hold(tOH) with min. 15ns(59page) Revised timing diagram Finalize Revised <NOR> - Release the stand-by current from typ. 5uA(max. 18uA) to typ. 10uA(max. 30uA). Revised <NAND> - Corrected Some typos in the timing diagram Draft Date March 20, 2002 March 28, 2002 March 28, 2002 June 17, 2002 October 15, 2002 June 18, 2003 August 14, 2003 Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site. http://samsungelectronics.com/semiconductors/products/products_index.html |
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